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  • Prevention and Leveling Method of the Warping in PCB ProductionPage Browsing:1069

    CatalogI IntroductionII Prevention of PCB warping During Processing2.1 Prevent the Warping Due to Improper Inventory Mode2.2 Avoid Warping Caused by Improper Design and Processing 2.3 Eliminate Stress on Substrate 2.4 Baking BoardIII Leveling Method of PCB warping3.1 Level Warping in time in the Production of PCB Boards3.2 Leveling Method of Finished PCB Warping ...

    Sep 24,2019
  • Structures and Applications of the FPCBPage Browsing:2574

    FPC, like many industrial technologies, has undergone a long process of transformation and innovation, and it has become quite perfect today. The functions of FPCB can be divided into four types: lead line, printed circuit, connector, and integration of function. So the FPC is available in computers, computer peripheral auxiliary systems, consumer livelihood appliances, and automobi...

    Mar 15,2019
  • Manufacturing process of PCBPage Browsing:1177

    Printed circuit board {PCB circuit board, is the provider of electrical connections for electronic components. It has been developed for more than 100 years; its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. This article mainly introduces the...

    Mar 1,2019
  • A Core Issue When Designing a PCB: Power-onPage Browsing:898

    When designing boards, we tend to pay attention to those parts that seem to be more core and more critical. They may not pay enough attention to those unimportant parts, but these places often bring catastrophic consequences.For example, the power-on time and sequence of the power supply, we need to pay attention to the rise time of the system power supply. Many people don't understand why it ...

    Nov 12,2018
  • Copying the Board, How Should I Copy It?Page Browsing:7206

    CatalogI IntroductionII Board Copying TechniquesI IntroductionSpeaking of copying board, you may feel that there is no technical content, and the people who have really copied should have a deep understanding -- this is not that simple.PCB copying board has no software, so it can only be measured and drawn with caliper edge, which it's very slow and its accuracy is also poor. However, It is ve...

    Nov 6,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC908AP64ACFAE Company:NXP Remark:IC MCU 8BIT 64KB FLASH 48LQFP Package:48-LQFP
MC908AP64ACFAE  Datasheet
In Stock:633
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PMEG3030EP-115 MC33742PEG Company:NXP / Freescale Remark:IC SYSTEM BASE W/CAN 28SOIC Package:28-SOIC (0.295", 7.50mm Width)
MC33742PEG  Datasheet
In Stock:28162
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PMEG3030EP-115 DS1818-10 Company:Maxim Integrated Remark:IC 2.88V W/PB 10% TO92-3 Package:TO-226-3, TO-92-3 (TO-226AA)
DS1818-10  Datasheet
In Stock:1150
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PMEG3030EP-115 MC9S12C64CFAE Company:NXP / Freescale Remark:IC MCU 16BIT 64KB FLASH 48LQFP Package:48-LQFP
MC9S12C64CFAE  Datasheet
In Stock:615
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PMEG3030EP-115 MCIMX507CVM8B Company:NXP / Freescale Remark:IC MPU I.MX50 800MHZ 400MAPBGA Package:400-LFBGA
MCIMX507CVM8B  Datasheet
In Stock:607
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PMEG3030EP-115 XC7K325T-2FFG900C Company:Xilinx Remark:IC FPGA 500 I/O 900FCBGA Package:900-BBGA, FCBGA
XC7K325T-2FFG900C  Datasheet
In Stock:1043
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PMEG3030EP-115 A3P030-1QNG48I Company:Microsemi Remark:IC FPGA 34 I/O 48QFN Package:48-VFQFN Exposed Pad
A3P030-1QNG48I  Datasheet
In Stock:146
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PMEG3030EP-115 MR301-24 Company:NEC Remark: Package:DIP
MR301-24  Datasheet
In Stock:121
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PMEG3030EP-115 H5PS5162FFK-E3C Company:HYNIX Remark: Package:BGA
H5PS5162FFK-E3C  Datasheet
In Stock:20200
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PMEG3030EP-115 MC9S12C32CPBE25 Company:NXP / Freescale Remark:IC MCU 16BIT 32KB FLASH 52LQFP Package:52-LQFP
MC9S12C32CPBE25  Datasheet
In Stock:951
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