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Product Attributes

Overview

Introducing the next generation of PowerQUICC II processors: the MPC8270, MPC8275 and MPC8280. Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture. The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded core and provides support for multiple communications protocols, including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family. A range of performance and package options Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards. The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

Features

603e core with 16K inst and 16K data caches

64-bit 60x bus, 32-bit Local / PCI bus

128K ROM, 32K IRAM, 32K DPRAM

Three FCCs supporting ATM, 10/100 Ethernet or HDLC

256 HDLC channels, 8 TDMs

4 SCCs, 2 SMCs, SPI, I2C

Memory controller built from SDRAM, UPM, GPCM machines

New features -- USB, RMII, UTOPIA improvements

Performance

•    333 MHz CPU, 250 MHz CPM, 83 MHz bus

•    450 MHz CPU, 300 MHz CPM, 100 MHz bus

•    Less than 2W @ full performance, 1.5V

Technology

•    HiP7AP, 3.3V I/O, 1.5V Core

•    480 TBGA, 37.5x37.5mm, 1.27mm ball pitch

Advantages and Disadvantages

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Compliance

ECCN / UNSPSC

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Product Manufacturer

NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.

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