• Structures and Applications of the FPCBPage Browsing:6289

    FPC, like many industrial technologies, has undergone a long process of transformation and innovation, and it has become quite perfect today. The functions of FPCB can be divided into four types: lead line, printed circuit, connector, and integration of function. So the FPC is available in computers, computer peripheral auxiliary systems, consumer livelihood appliances, and automobi...

    Mar 15,2019
  • Manufacturing process of PCBPage Browsing:2793

    Printed circuit board {PCB circuit board, is the provider of electrical connections for electronic components. It has been developed for more than 100 years; its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. This article mainly introduces the...

    Mar 1,2019
  • How to Reduce Electromagnetic Interference in Front-end Analog DevicesPage Browsing:2780

    In the fields of medical equipment, automotive instrumentation, and industrial control, when equipment design involves strain gauges, sensor interfaces, and current monitoring, precision analog front-end amplifiers are often required to extract and amplify very weak real signals and suppress common unwanted signals such as mode voltage and noise.First, the designer will concentrate on ensuring tha...

    Nov 13,2018
  • A Core Issue When Designing a PCB: Power-onPage Browsing:2318

    When designing boards, we tend to pay attention to those parts that seem to be more core and more critical. They may not pay enough attention to those unimportant parts, but these places often bring catastrophic consequences.For example, the power-on time and sequence of the power supply, we need to pay attention to the rise time of the system power supply. Many people don't understand why it ...

    Nov 12,2018
  • Eliminate Electromagnetic Interference Solutions for Single-chip SystemsPage Browsing:2016

    CatalogI IntroductionII Interference Coupling Method2.1 Conductive EMI2.2 Common Impedance Coupling2.3 Radiation Coupling2.4 Radiation EmissionIII Factors Affecting EMC3.1 Voltage3.2 Frequency3.3 Ground3.4 PCB design3.5 Power supply decouplingIV Electromagnetic Compatibility Design of PCB3.1 General principles of PCB design3.2 PCB and circuit anti-...

    Nov 7,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 K9K8G08UOE-SCB0 Company:samsung Remark: Package:tsop
K9K8G08UOE-SCB0  Datasheet
In Stock:5500
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PMEG3030EP-115 PWR263S-20-3300F Company:Bourns Remark:RES SMD 330 OHM 1% 20W D2PAK Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
PWR263S-20-3300F  Datasheet
In Stock:108
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PMEG3030EP-115 MC34905CS5EK Company:NXP / Freescale Remark:IC SBC HIGH SPEED CAN 5V 32SOIC Package:32-BSSOP (0.295", 7.50mm Width) Exposed Pad
MC34905CS5EK  Datasheet
In Stock:88
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PMEG3030EP-115 MCF52110CEP66 Company:NXP Remark:IC MCU 32BIT 128KB FLASH 64QFN Package:64-VFQFN Exposed Pad
MCF52110CEP66  Datasheet
In Stock:1128
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PMEG3030EP-115 MC9S08PT32VLC Company:NXP Remark:IC MCU 8BIT 32KB FLASH 32LQFP Package:32-LQFP
MC9S08PT32VLC  Datasheet
In Stock:103
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PMEG3030EP-115 MPC8280VVQLDA Company:NXP / Freescale Remark:IC MPU MPC82XX 333MHZ 408TBGA Package:480-LBGA
MPC8280VVQLDA  Datasheet
In Stock:744
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PMEG3030EP-115 MAX491EESD+ Company:Maxim Integrated Remark:IC TXRX RS485/RS422 14-SOIC Package:14-SOIC
MAX491EESD+  Datasheet
In Stock:4906
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PMEG3030EP-115 MC9S12C32CPBE25 Company:NXP / Freescale Remark:IC MCU 16BIT 32KB FLASH 52LQFP Package:52-LQFP
MC9S12C32CPBE25  Datasheet
In Stock:951
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PMEG3030EP-115 70V7599S166BCI8 Company:IDT Remark:SRAM 128K x 36 Synchronous Bank-Switchable Dual-Port SRAM Package:
70V7599S166BCI8  Datasheet
In Stock:2
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PMEG3030EP-115 BAS70KFILM Company:STMicroelectronics Remark:DIODE SCHOTTKY 70V 70MA SOD523 Package:SC-79, SOD-523
BAS70KFILM  Datasheet
In Stock:79020
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