• Structures and Applications of the FPCBPage Browsing:2386

    FPC, like many industrial technologies, has undergone a long process of transformation and innovation, and it has become quite perfect today. The functions of FPCB can be divided into four types: lead line, printed circuit, connector, and integration of function. So the FPC is available in computers, computer peripheral auxiliary systems, consumer livelihood appliances, and automobi...

    Mar 15,2019
  • Manufacturing process of PCBPage Browsing:1104

    Printed circuit board {PCB circuit board, is the provider of electrical connections for electronic components. It has been developed for more than 100 years; its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. This article mainly introduces the...

    Mar 1,2019
  • How to Reduce Electromagnetic Interference in Front-end Analog DevicesPage Browsing:946

    In the fields of medical equipment, automotive instrumentation, and industrial control, when equipment design involves strain gauges, sensor interfaces, and current monitoring, precision analog front-end amplifiers are often required to extract and amplify very weak real signals and suppress common unwanted signals such as mode voltage and noise.First, the designer will concentrate on ensuring tha...

    Nov 13,2018
  • A Core Issue When Designing a PCB: Power-onPage Browsing:845

    When designing boards, we tend to pay attention to those parts that seem to be more core and more critical. They may not pay enough attention to those unimportant parts, but these places often bring catastrophic consequences.For example, the power-on time and sequence of the power supply, we need to pay attention to the rise time of the system power supply. Many people don't understand why it ...

    Nov 12,2018
  • Eliminate Electromagnetic Interference Solutions for Single-chip SystemsPage Browsing:853

    CatalogI IntroductionII Interference Coupling Method2.1 Conductive EMI2.2 Common Impedance Coupling2.3 Radiation Coupling2.4 Radiation EmissionIII Factors Affecting EMC3.1 Voltage3.2 Frequency3.3 Ground3.4 PCB design3.5 Power supply decouplingIV Electromagnetic Compatibility Design of PCB3.1 General principles of PCB design3.2 PCB and circuit anti-...

    Nov 7,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MPC8544CVTALFA Company:NXP / Freescale Remark:IC MPU MPC85XX 667MHZ 783FCBGA Package:BGA
MPC8544CVTALFA  Datasheet
In Stock:69
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PMEG3030EP-115 XC6VLX130T-L1FFG1156I Company:Xilinx Inc. Remark:IC FPGA 600 I/O 1156FCBGA Package:1156-BBGA, FCBGA
XC6VLX130T-L1FFG1156I  Datasheet
In Stock:146
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PMEG3030EP-115 MPC8548EVTAUJC Company:NXP / Freescale Remark:IC MPU MPC85XX 1.333GHZ 783BGA Package:783-BBGA, FCBGA
MPC8548EVTAUJC  Datasheet
In Stock:842
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PMEG3030EP-115 K9F4G08UOA-P1BO Company:SAMSUNG Remark:4G-bit NAND Flash Memory with spare 128M-bit Package:
K9F4G08UOA-P1BO  Datasheet
In Stock:5960
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PMEG3030EP-115 MCIMX31LCVKN5D Company:NXP / Freescale Remark:IC MPU I.MX31 532MHZ 457MAPBGA Package:457-LFBGA
MCIMX31LCVKN5D  Datasheet
In Stock:147
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PMEG3030EP-115 IS42S32400F-7TL Company:ISSI Remark:IC SDRAM 128M 143MHZ 86TSOP Package:86-TFSOP (0.400", 10.16mm Width)
IS42S32400F-7TL  Datasheet
In Stock:1104
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PMEG3030EP-115 MR82C54 Company:NTERSIL Remark: Package:CLCC
MR82C54  Datasheet
In Stock:455
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PMEG3030EP-115 CY62157DV30LL-55ZSXI Company:Cypress Semiconductor Corp Remark:IC SRAM 8MBIT 55NS 44TSOP Package:44-TSOP (0.400", 10.16mm Width)
CY62157DV30LL-55ZSXI  Datasheet
In Stock:1200
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PMEG3030EP-115 MAX4507EAP Company:Maxim Integrated Remark:IC SIGNAL LINE PROTECTOR 20-SSOP Package:20-SSOP (0.209", 5.30mm Width)
MAX4507EAP  Datasheet
In Stock:2254
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PMEG3030EP-115 MC9S08DZ60AMLH Company:NXP / Freescale Remark:IC MCU 8BIT 60KB FLASH 64LQFP Package:64-LQFP
MC9S08DZ60AMLH  Datasheet
In Stock:2396
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