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Structures and Applications of the FPCBPage Browsing:6289
FPC, like many industrial technologies, has undergone a long process of transformation and innovation, and it has become quite perfect today. The functions of FPCB can be divided into four types: lead line, printed circuit, connector, and integration of function. So the FPC is available in computers, computer peripheral auxiliary systems, consumer livelihood appliances, and automobi...
Mar 15,2019 -
Manufacturing process of PCBPage Browsing:2793
Printed circuit board {PCB circuit board, is the provider of electrical connections for electronic components. It has been developed for more than 100 years; its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. This article mainly introduces the...
Mar 1,2019 -
How to Reduce Electromagnetic Interference in Front-end Analog DevicesPage Browsing:2780
In the fields of medical equipment, automotive instrumentation, and industrial control, when equipment design involves strain gauges, sensor interfaces, and current monitoring, precision analog front-end amplifiers are often required to extract and amplify very weak real signals and suppress common unwanted signals such as mode voltage and noise.First, the designer will concentrate on ensuring tha...
Nov 13,2018 -
A Core Issue When Designing a PCB: Power-onPage Browsing:2318
When designing boards, we tend to pay attention to those parts that seem to be more core and more critical. They may not pay enough attention to those unimportant parts, but these places often bring catastrophic consequences.For example, the power-on time and sequence of the power supply, we need to pay attention to the rise time of the system power supply. Many people don't understand why it ...
Nov 12,2018 -
Eliminate Electromagnetic Interference Solutions for Single-chip SystemsPage Browsing:2016
CatalogI IntroductionII Interference Coupling Method2.1 Conductive EMI2.2 Common Impedance Coupling2.3 Radiation Coupling2.4 Radiation EmissionIII Factors Affecting EMC3.1 Voltage3.2 Frequency3.3 Ground3.4 PCB design3.5 Power supply decouplingIV Electromagnetic Compatibility Design of PCB3.1 General principles of PCB design3.2 PCB and circuit anti-...
Nov 7,2018
Ordering & Quality
Photo | Mfr. Part # | Company | Description | Package | Qty | K9K8G08UOE-SCB0 | Company:samsung | Remark: | Package:tsop |
K9K8G08UOE-SCB0 Datasheet |
In Stock:5500 Inquiry |
Inquiry | PWR263S-20-3300F | Company:Bourns | Remark:RES SMD 330 OHM 1% 20W D2PAK | Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
PWR263S-20-3300F Datasheet |
In Stock:108 Inquiry |
Inquiry | MC34905CS5EK | Company:NXP / Freescale | Remark:IC SBC HIGH SPEED CAN 5V 32SOIC | Package:32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
MC34905CS5EK Datasheet |
In Stock:88 Inquiry |
Inquiry | MCF52110CEP66 | Company:NXP | Remark:IC MCU 32BIT 128KB FLASH 64QFN | Package:64-VFQFN Exposed Pad |
MCF52110CEP66 Datasheet |
In Stock:1128 Inquiry |
Inquiry | MC9S08PT32VLC | Company:NXP | Remark:IC MCU 8BIT 32KB FLASH 32LQFP | Package:32-LQFP |
MC9S08PT32VLC Datasheet |
In Stock:103 Inquiry |
Inquiry | MPC8280VVQLDA | Company:NXP / Freescale | Remark:IC MPU MPC82XX 333MHZ 408TBGA | Package:480-LBGA |
MPC8280VVQLDA Datasheet |
In Stock:744 Inquiry |
Inquiry | MAX491EESD+ | Company:Maxim Integrated | Remark:IC TXRX RS485/RS422 14-SOIC | Package:14-SOIC |
MAX491EESD+ Datasheet |
In Stock:4906 Inquiry |
Inquiry | MC9S12C32CPBE25 | Company:NXP / Freescale | Remark:IC MCU 16BIT 32KB FLASH 52LQFP | Package:52-LQFP |
MC9S12C32CPBE25 Datasheet |
In Stock:951 Inquiry |
Inquiry | 70V7599S166BCI8 | Company:IDT | Remark:SRAM 128K x 36 Synchronous Bank-Switchable Dual-Port SRAM | Package: |
70V7599S166BCI8 Datasheet |
In Stock:2 Inquiry |
Inquiry | BAS70KFILM | Company:STMicroelectronics | Remark:DIODE SCHOTTKY 70V 70MA SOD523 | Package:SC-79, SOD-523 |
BAS70KFILM Datasheet |
In Stock:79020 Inquiry |
Inquiry |