• Structures and Applications of the FPCBPage Browsing:3468

    FPC, like many industrial technologies, has undergone a long process of transformation and innovation, and it has become quite perfect today. The functions of FPCB can be divided into four types: lead line, printed circuit, connector, and integration of function. So the FPC is available in computers, computer peripheral auxiliary systems, consumer livelihood appliances, and automobi...

    Mar 15,2019
  • Manufacturing process of PCBPage Browsing:1575

    Printed circuit board {PCB circuit board, is the provider of electrical connections for electronic components. It has been developed for more than 100 years; its design is mainly layout design; the main advantage of using the circuit board is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. This article mainly introduces the...

    Mar 1,2019
  • How to Reduce Electromagnetic Interference in Front-end Analog DevicesPage Browsing:1644

    In the fields of medical equipment, automotive instrumentation, and industrial control, when equipment design involves strain gauges, sensor interfaces, and current monitoring, precision analog front-end amplifiers are often required to extract and amplify very weak real signals and suppress common unwanted signals such as mode voltage and noise.First, the designer will concentrate on ensuring tha...

    Nov 13,2018
  • A Core Issue When Designing a PCB: Power-onPage Browsing:1179

    When designing boards, we tend to pay attention to those parts that seem to be more core and more critical. They may not pay enough attention to those unimportant parts, but these places often bring catastrophic consequences.For example, the power-on time and sequence of the power supply, we need to pay attention to the rise time of the system power supply. Many people don't understand why it ...

    Nov 12,2018
  • Eliminate Electromagnetic Interference Solutions for Single-chip SystemsPage Browsing:1212

    CatalogI IntroductionII Interference Coupling Method2.1 Conductive EMI2.2 Common Impedance Coupling2.3 Radiation Coupling2.4 Radiation EmissionIII Factors Affecting EMC3.1 Voltage3.2 Frequency3.3 Ground3.4 PCB design3.5 Power supply decouplingIV Electromagnetic Compatibility Design of PCB3.1 General principles of PCB design3.2 PCB and circuit anti-...

    Nov 7,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 SL811HST-AXC Company:Cypress Semiconductor Corp Remark:IC USB HOST/SLAVE CTRLR 48TQFP Package:TQFP
SL811HST-AXC  Datasheet
In Stock:15200
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PMEG3030EP-115 MBRD340G Company:ON Semiconductor Remark:DIODE SCHOTTKY 40V 3A DPAK Package:TO-252-3, DPak (2 Leads + Tab), SC-63
MBRD340G  Datasheet
In Stock:604
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PMEG3030EP-115 FCSL64R010FER Company:Ohmite Remark:RES SMD 0.01 OHM 2W 2512 WIDE Package:Wide 2512 (6432 Metric), 1225
FCSL64R010FER  Datasheet
In Stock:2954
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PMEG3030EP-115 XC7K480T-1FFG901C Company:Xilinx Inc. Remark:IC FPGA 380 I/O 901FCBGA Package:BGA
XC7K480T-1FFG901C  Datasheet
In Stock:88
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PMEG3030EP-115 RB400DT146 Company:Rohm Semiconductor Remark:DIODE SCHOTTKY 40V 500MA SMD3 Package:TO-236-3, SC-59, SOT-23-3
RB400DT146  Datasheet
In Stock:9266
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PMEG3030EP-115 70V7599S166BCI8 Company:IDT Remark:SRAM 128K x 36 Synchronous Bank-Switchable Dual-Port SRAM Package:
70V7599S166BCI8  Datasheet
In Stock:2
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PMEG3030EP-115 MAX4507EAP Company:Maxim Integrated Remark:IC SIGNAL LINE PROTECTOR 20-SSOP Package:20-SSOP (0.209", 5.30mm Width)
MAX4507EAP  Datasheet
In Stock:2254
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PMEG3030EP-115 W631GG6KB-15 Company:Winbond Electronics Remark:IC DRAM 1G PARALLEL 96WBGA Package:FBGA
W631GG6KB-15  Datasheet
In Stock:3070
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PMEG3030EP-115 MC9RS08KB2CSC Company:NXP Remark:IC MCU 8BIT 2KB FLASH 8SOIC Package:8-SOIC (0.154", 3.90mm Width)
MC9RS08KB2CSC  Datasheet
In Stock:10913
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PMEG3030EP-115 MC68360ZQ25L Company:Freescale Semiconductor - NXP Remark:IC MPU M683XX 25MHZ 357BGA Package:BGA
MC68360ZQ25L  Datasheet
In Stock:811
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