• The Sino-US comparison in Information TechnologyPage Browsing:1518

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

    Aug 4,2018
  • New Materials Selection Has Been an TrendPage Browsing:1168

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

    Jul 26,2018
  • Common Guide for Selecting Electronic ComponentsPage Browsing:1202

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

    Jul 25,2018
  • List of Integrated Circuit Packaging TypesPage Browsing:2049

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

    Jul 24,2018
  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:1656

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC68HC908LK24CFU Company:NXP Remark:IC MCU 8BIT 24KB FLASH 64QFP Package:64-QFP
MC68HC908LK24CFU  Datasheet
In Stock:3071
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PMEG3030EP-115 MC9S08GB32CFUE Company:NXP / Freescale Remark:IC MCU 8BIT 32KB FLASH 64LQFP Package:64-LQFP
MC9S08GB32CFUE  Datasheet
In Stock:653
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PMEG3030EP-115 73M2R010F Company:CTS Electronic Components Remark:RES SMD 0.01 OHM 1% 2W 2512 Package:2512 J-Lead
73M2R010F  Datasheet
In Stock:1263
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PMEG3030EP-115 MCIMX353DJQ5C Company:NXP / Freescale Remark:IC MPU I.MX35 532MHZ 400MAPBGA Package:400-LFBGA
MCIMX353DJQ5C  Datasheet
In Stock:24833
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PMEG3030EP-115 MAX6805US26D3+T Company:Maxim Integrated Remark:IC RESET MPU LOW PWR SOT143-4 Package:TO-253-4, TO-253AA
MAX6805US26D3+T  Datasheet
In Stock:4060
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PMEG3030EP-115 MC33742PEG Company:NXP / Freescale Remark:IC SYSTEM BASE W/CAN 28SOIC Package:28-SOIC (0.295", 7.50mm Width)
MC33742PEG  Datasheet
In Stock:28162
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PMEG3030EP-115 MC68CK16Z1CAG16 Company:NXP Remark:IC MCU 16BIT 144LQFP Package:144-LQFP
MC68CK16Z1CAG16  Datasheet
In Stock:18655
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PMEG3030EP-115 DS1816-10+ Company:Maxim Integrated Remark:IC 2.88V O-D 10% TO92-3 Package:TO-226-3, TO-92-3 (TO-226AA)
DS1816-10+  Datasheet
In Stock:156
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PMEG3030EP-115 DSS16-01AS Company:IXYS Remark:DIODE SCHOTTKY 100V 16A TO263AB Package:TO-263-3, D²Pak (2 Leads + Tab), TO-
DSS16-01AS  Datasheet
In Stock:580
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PMEG3030EP-115 MCF52110CEP66 Company:NXP Remark:IC MCU 32BIT 128KB FLASH 64QFN Package:64-VFQFN Exposed Pad
MCF52110CEP66  Datasheet
In Stock:1128
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