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The Sino-US comparison in Information TechnologyPage Browsing:1095
IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...
Aug 4,2018 -
New Materials Selection Has Been an TrendPage Browsing:850
Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...
Jul 26,2018 -
Common Guide for Selecting Electronic ComponentsPage Browsing:888
Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization . c、Purchasing Rule The component...
Jul 25,2018 -
List of Integrated Circuit Packaging TypesPage Browsing:1471
Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...
Jul 24,2018 -
Why do Internet Giants Want to Self-develop Chips?Page Browsing:1074
IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...
Jul 21,2018
Ordering & Quality
Photo | Mfr. Part # | Company | Description | Package | Qty |
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MC68HC908LK24CFU | Company:NXP | Remark:IC MCU 8BIT 24KB FLASH 64QFP | Package:64-QFP |
![]() MC68HC908LK24CFU Datasheet |
In Stock:3071 Inquiry |
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MC33742PEG | Company:NXP / Freescale | Remark:IC SYSTEM BASE W/CAN 28SOIC | Package:28-SOIC (0.295", 7.50mm Width) |
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In Stock:28162 Inquiry |
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DS1818-10 | Company:Maxim Integrated | Remark:IC 2.88V W/PB 10% TO92-3 | Package:TO-226-3, TO-92-3 (TO-226AA) |
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In Stock:1150 Inquiry |
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MC68882CFN25A | Company:NXP | Remark:- | Package:PLCC68 |
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In Stock:115 Inquiry |
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MBRD340G | Company:ON Semiconductor | Remark:DIODE SCHOTTKY 40V 3A DPAK | Package:TO-252-3, DPak (2 Leads + Tab), SC-63 |
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In Stock:604 Inquiry |
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MC9S08GT16CFBE | Company:NXP / Freescale | Remark:IC MCU 8BIT 16KB FLASH 44QFP | Package:44-QFP |
![]() MC9S08GT16CFBE Datasheet |
In Stock:16320 Inquiry |
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MC9S08QA2CFQE | Company:NXP | Remark:IC MCU 8BIT 2KB FLASH 8QFN | Package:8-VDFN Exposed Pad |
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In Stock:25275 Inquiry |
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MBRS130LT3G | Company:ON Semiconductor | Remark:DIODE SCHOTTKY 30V 2A SMB | Package:SMB |
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In Stock:516247 Inquiry |
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MR301-24 | Company:NEC | Remark: | Package:DIP |
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In Stock:121 Inquiry |
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ICE65L04F-TCS63I | Company:Lattice | Remark:IC FPGA 48 I/O 63WLCSP | Package:BGA63 |
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In Stock:5759 Inquiry |
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