• The Sino-US comparison in Information TechnologyPage Browsing:1707

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

    Aug 4,2018
  • New Materials Selection Has Been an TrendPage Browsing:1302

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

    Jul 26,2018
  • Common Guide for Selecting Electronic ComponentsPage Browsing:1361

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

    Jul 25,2018
  • List of Integrated Circuit Packaging TypesPage Browsing:2328

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

    Jul 24,2018
  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:1862

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 BAT48 Company:STMicroelectronics Remark:DIODE SCHOTTKY 40V 350MA DO35 Package:DO-204AH, DO-35, Axial
BAT48  Datasheet
In Stock:55560
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PMEG3030EP-115 MAX1490AEPG+ Company:MAXIM Remark:IC RS485/RS422 DATA INTRFC 24DIP Package:PDIP-24
MAX1490AEPG+  Datasheet
In Stock:8428
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PMEG3030EP-115 MC9S12D32MFVE Company:Freescale Remark:MCU 16-bit HCS12 CISC 32KB Flash 2.5V/5V Automotive 80-Pin PQFP Tray Package:QFP
MC9S12D32MFVE  Datasheet
In Stock:74
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PMEG3030EP-115 MC9S08QA2CFQE Company:NXP Remark:IC MCU 8BIT 2KB FLASH 8QFN Package:8-VDFN Exposed Pad
MC9S08QA2CFQE  Datasheet
In Stock:25275
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PMEG3030EP-115 ADSP-BF533SBBCZ500 Company:Analog Devices Remark:IC DSP CTLR 16B 500MHZ 160CSPBGA Package:BGA
ADSP-BF533SBBCZ500  Datasheet
In Stock:1258
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PMEG3030EP-115 MCF52110CEP66 Company:NXP Remark:IC MCU 32BIT 128KB FLASH 64QFN Package:64-VFQFN Exposed Pad
MCF52110CEP66  Datasheet
In Stock:1128
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PMEG3030EP-115 RHC2512FT150R Company:Stackpole Electronics Remark:RES SMD 150 OHM 1% 2W 2512 Package:2512 (6432 Metric)
RHC2512FT150R  Datasheet
In Stock:19360
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PMEG3030EP-115 FLC10-200H Company:STMicroelectronics Remark:IC FIRE LIGHTER CIRCUIT I-PAK Package:TO-251-3 Long Leads, IPak, TO-251AB
FLC10-200H  Datasheet
In Stock:5153
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PMEG3030EP-115 DS1816R-5+T&R Company:Maxim Integrated Remark:IC 3.06V OD 5% SOT23-3 Package:TO-236-3, SC-59, SOT-23-3
DS1816R-5+T&R  Datasheet
In Stock:7060
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PMEG3030EP-115 BCM7501KFB P20 Company:BROADCOM Remark:IC Chips Package:BGA64
BCM7501KFB P20  Datasheet
In Stock:19250
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