• The Sino-US comparison in Information TechnologyPage Browsing:1261

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

    Aug 4,2018
  • New Materials Selection Has Been an TrendPage Browsing:976

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

    Jul 26,2018
  • Common Guide for Selecting Electronic ComponentsPage Browsing:1004

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

    Jul 25,2018
  • List of Integrated Circuit Packaging TypesPage Browsing:1704

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

    Jul 24,2018
  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:1282

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC9S12D32MFVE Company:Freescale Remark:MCU 16-bit HCS12 CISC 32KB Flash 2.5V/5V Automotive 80-Pin PQFP Tray Package:QFP
MC9S12D32MFVE  Datasheet
In Stock:74
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PMEG3030EP-115 HCS200-I/SN Company:Microchip Technology Remark:IC CODE HOPP ENCODER 7FUNC 8SOIC Package:8-SOIC (0.154", 3.90mm Width)
HCS200-I/SN  Datasheet
In Stock:506
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PMEG3030EP-115 PWR263S-20-3300F Company:Bourns Remark:RES SMD 330 OHM 1% 20W D2PAK Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
PWR263S-20-3300F  Datasheet
In Stock:108
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PMEG3030EP-115 MBRD340G Company:ON Semiconductor Remark:DIODE SCHOTTKY 40V 3A DPAK Package:TO-252-3, DPak (2 Leads + Tab), SC-63
MBRD340G  Datasheet
In Stock:604
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PMEG3030EP-115 MC33910G5AC Company:NXP Remark:IC SYSTEM BASIS CHIP 32LQFP Package:32-LQFP
MC33910G5AC  Datasheet
In Stock:5153
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PMEG3030EP-115 MKL15Z64VLK4 Company:Freescale Semiconductor Remark:IC MCU 32BIT 64KB FLASH 80LQFP Package:80-LQFP
MKL15Z64VLK4  Datasheet
In Stock:664
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PMEG3030EP-115 MC68EN360AI25L Company:NXP Remark:IC MPU M683XX 25MHZ 240FQFP Package:240-BFQFP
MC68EN360AI25L  Datasheet
In Stock:3244
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PMEG3030EP-115 MC9S08JR12FAE Company:NXP / Freescale Remark:IC MCU 8BIT FLASH 48LQFP Package:48-LQFP
MC9S08JR12FAE  Datasheet
In Stock:83598
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PMEG3030EP-115 ATTINY13A-SUR Company:Microchip Remark:IC MCU 8BIT 1KB FLASH 8SOIC Package:08LSOIJ
ATTINY13A-SUR  Datasheet
In Stock:7060
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PMEG3030EP-115 S9S12G128F0CLH Company:NXP Remark:IC MCU 16BIT 128KB FLASH 64LQFP Package:64-LQFP
S9S12G128F0CLH  Datasheet
In Stock:5046
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