• The Sino-US comparison in Information TechnologyPage Browsing:1095

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

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  • New Materials Selection Has Been an TrendPage Browsing:850

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

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  • Common Guide for Selecting Electronic ComponentsPage Browsing:888

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

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  • List of Integrated Circuit Packaging TypesPage Browsing:1471

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

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  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:1074

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC68HC908LK24CFU Company:NXP Remark:IC MCU 8BIT 24KB FLASH 64QFP Package:64-QFP
MC68HC908LK24CFU  Datasheet
In Stock:3071
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PMEG3030EP-115 MC33742PEG Company:NXP / Freescale Remark:IC SYSTEM BASE W/CAN 28SOIC Package:28-SOIC (0.295", 7.50mm Width)
MC33742PEG  Datasheet
In Stock:28162
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PMEG3030EP-115 DS1818-10 Company:Maxim Integrated Remark:IC 2.88V W/PB 10% TO92-3 Package:TO-226-3, TO-92-3 (TO-226AA)
DS1818-10  Datasheet
In Stock:1150
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PMEG3030EP-115 MC68882CFN25A Company:NXP Remark:- Package:PLCC68
MC68882CFN25A  Datasheet
In Stock:115
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PMEG3030EP-115 MBRD340G Company:ON Semiconductor Remark:DIODE SCHOTTKY 40V 3A DPAK Package:TO-252-3, DPak (2 Leads + Tab), SC-63
MBRD340G  Datasheet
In Stock:604
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PMEG3030EP-115 MC9S08GT16CFBE Company:NXP / Freescale Remark:IC MCU 8BIT 16KB FLASH 44QFP Package:44-QFP
MC9S08GT16CFBE  Datasheet
In Stock:16320
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PMEG3030EP-115 MC9S08QA2CFQE Company:NXP Remark:IC MCU 8BIT 2KB FLASH 8QFN Package:8-VDFN Exposed Pad
MC9S08QA2CFQE  Datasheet
In Stock:25275
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PMEG3030EP-115 MBRS130LT3G Company:ON Semiconductor Remark:DIODE SCHOTTKY 30V 2A SMB Package:SMB
MBRS130LT3G  Datasheet
In Stock:516247
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PMEG3030EP-115 MR301-24 Company:NEC Remark: Package:DIP
MR301-24  Datasheet
In Stock:121
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PMEG3030EP-115 ICE65L04F-TCS63I Company:Lattice Remark:IC FPGA 48 I/O 63WLCSP Package:BGA63
ICE65L04F-TCS63I  Datasheet
In Stock:5759
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