• The Sino-US comparison in Information TechnologyPage Browsing:1989

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

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  • New Materials Selection Has Been an TrendPage Browsing:1516

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

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  • Common Guide for Selecting Electronic ComponentsPage Browsing:1614

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

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  • List of Integrated Circuit Packaging TypesPage Browsing:2722

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

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  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:2164

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC68EN360AI25L Company:NXP Remark:IC MPU M683XX 25MHZ 240FQFP Package:240-BFQFP
MC68EN360AI25L  Datasheet
In Stock:3244
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PMEG3030EP-115 CY7C131E-55NXI Company:Cypress Semiconductor Remark:SRAM 8Kb (1Kb x 8) 55ns Dual-Port SRAM Package:
CY7C131E-55NXI  Datasheet
In Stock:96
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PMEG3030EP-115 CY62157DV30LL-55ZSXI Company:Cypress Semiconductor Corp Remark:IC SRAM 8MBIT 55NS 44TSOP Package:44-TSOP (0.400", 10.16mm Width)
CY62157DV30LL-55ZSXI  Datasheet
In Stock:1200
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PMEG3030EP-115 RD0306T-H Company:ON Semiconductor Remark:DIODE GEN PURP 600V 3A TP Package:TO-251-3 Long Leads, IPak, TO-251AB
RD0306T-H  Datasheet
In Stock:6530
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PMEG3030EP-115 XC7A200T-2FBG484I Company:Xilinx Remark:IC FPGA ARTIX7 285 I/O 484FCBGA Package:BGA
XC7A200T-2FBG484I  Datasheet
In Stock:118
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PMEG3030EP-115 MC9S08DZ60AMLH Company:NXP / Freescale Remark:IC MCU 8BIT 60KB FLASH 64LQFP Package:64-LQFP
MC9S08DZ60AMLH  Datasheet
In Stock:2396
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PMEG3030EP-115 MBRS130LT3G Company:ON Semiconductor Remark:DIODE SCHOTTKY 30V 2A SMB Package:SMB
MBRS130LT3G  Datasheet
In Stock:516247
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PMEG3030EP-115 MC9S12GC64MFUE Company:NXP Remark:IC MCU 16BIT 64KB FLASH 80QFP Package:80-QFP
MC9S12GC64MFUE  Datasheet
In Stock:4926
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PMEG3030EP-115 DS1816R-5+T&R Company:Maxim Integrated Remark:IC 3.06V OD 5% SOT23-3 Package:TO-236-3, SC-59, SOT-23-3
DS1816R-5+T&R  Datasheet
In Stock:7060
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PMEG3030EP-115 MAX491ECSD+T Company:Maxim Integrated Remark:IC TXRX RS485/RS422 14-SOIC Package:14-SOIC
MAX491ECSD+T  Datasheet
In Stock:27584
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