Home > Product
Manufacturer Part#:

XC7A200T-2FBG484I

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Xilinx
Description: IC FPGA ARTIX7 285 I/O 484FCBGA
  datasheetXC7A200T-2FBG484I  Datasheet
Package: BGA
Quantity: 118 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

CAD Models

 XC7A200T-2FBG484I   Symbol.png

 XC7A200T-2FBG484I   Symbol

 XC7A200T-2FBG484I   Footprin.png

 XC7A200T-2FBG484I   Footprint


Lifecycle Status Indicator

 XC7A200T-2FBG484I  Lifecycle Status Indicator.png

 XC7A200T-2FBG484I  Lifecycle Status Indicator


Product Attributes

Manufacturer

XILINX

Category

Integrated Circuits (ICs)

Family

Embedded - FPGAs (Field Programmable Gate Array)

Series

Artix-7

Status

Active

Brand

Xilinx

Clock Management

MMCM, PLL

Contact Plating

Copper, Tin, Silver

Configuration Memory

32MB QSPI

REACH Compliant

Yes

EU RoHS Compliant

Yes

Device Logic Cells

215360

Device Logic Units

134600

Dedicated DSP

740

Display Mode

HDMI Output; LCD Display (2 x 16)

Ethernet

Yes

GPIO

Yes

Interface Standards

FMC HPC; I2C; Pmod; XADC; SMA; SFP

JESD-30 Code

S-PBGA-B484

JESD-609 Code

e1

Mounting Type

Surface Mount

Memory Card Interface

SD Card

Memory Size

1GB

Memory Type

DDR3

Maximum Operating Temperature

100 °C

Minimum Operating Temperature

-40 °C

Maximum Processing Temperature

250 °C

Maximum Operating Supply Voltage

1.05 V

Typical Operating Supply Voltage

1 V

Minimum Operating Supply Voltage

0.95 V

Maximum Clock Frequency

1286 MHz

Maximum Combinatorial Delay of a CLB

1.05 ns

Number of I/Os

285

Number of Logic Blocks (LABs)

16825

Number of Logic Elements/Cells

215360

Number of Pins

484

Number of Registers

269200

Number of Inputs

285

Number of Outputs

285

Number of Multipliers

740 (25x18)

Device Number of DLLs/PLLs

10

Total Number of Block RAM

365

Organization

16825 CLBS

Package / Case

484-BBGA, FCBGA

Mfr Package Description

FBGA-484

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA484,22X22,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Package Length

23 mm

Package Width

23 mm

Package Height

1.84 mm

Seated Plane Height

2.34 mm

Pin Pitch

1

PCI Blocks

1

Power Supplies

1 V

Process Technology

28 nm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Reflow Solder Time (Sec)

30

Number of Reflow Cycle

3

RAM Size

13455360b

Re-programmability Support

1

Screening Level

Industrial

Speed Grade

2

Sub Category

Field Programmable Gate Arrays

Supplier Device Package

484-FCBGA (23x23)

Technology

CMOS

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Position

BOTTOM

Transceiver Blocks

16

Transceiver Speed

6.6Gbps

USB

USB-Serial Bridge


Features

● Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

● 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

● High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

● High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

● A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

● DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

● Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

● Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

● Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

● Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

● Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Overview

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications. 

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.d

HTSN

PARTS...

SCHEDULE B

PARTS...


Documents & Media

Datasheets

Artix-7 FPGAS Dtasheet

Artix-7 FPGAS Brief

XC7A100T/200T Errata

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013


Product Manufacturer


Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known as the semiconductor company that invented the field-programmable gate array (FPGA) and created the first fabless manufacturing model.

Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

 

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

118

XILINX

IC FPGA ARTIX7 285 I/O 484FCBGA

DigiKey

348

Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

Avnet

0

Xilinx

FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 484-Pin Lidless FCBGA

Farnell element14

0

XILINX

FPGA ARTIX-7 285 I/O FCBGA-484

Chip One Exchange

27

XILINX

AVAILABLE ; DC: 2019+


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 XC7A200T-2FBG484I   Popularity by Region.png

 XC7A200T-2FBG484I   Popularity by Region


Market Price Analysis

 XC7A200T-2FBG484I   Market Price Analysis.png

 XC7A200T-2FBG484I   Market Price Analysis


Pictures

XC7A200T-2FBG484I.jpgXC7A200T-2FBG484I 2.pngXC7A200T-2FBG484I 3.jpgXC7A200T-2FBG484I 4.jpg

 XC7A200T-2FBG484I  Images

Latest Products

XC3S50A-4VQG100C

Xilinx

XC3S50A-4VQG100CIC FPGA 68 I/O 100VQFP

Learn More

ICE65L04F-TCS63I

Lattice

ICE65L04F-TCS63IIC FPGA 48 I/O 63WLCSP

Learn More

XC7K325T-2FFG900C

Xilinx

XC7K325T-2FFG900CIC FPGA 500 I/O 900FCBGA

Learn More