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XC7K325T-2FFG900C

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Xilinx
Description: IC FPGA 500 I/O 900FCBGA
  datasheetXC7K325T-2FFG900C  Datasheet
Package: 900-BBGA, FCBGA
Quantity: 1043 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

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Product Attributes

Manufacturer

Xilinx Inc.

Product Category

Embedded - FPGAs (Field Programmable Gate Array)

Series

Kintex-7

status

Active

Configuration Memory

16MB QSPI; 128MB BPI FLASH

Clock Management

MMCM, PLL

Clock Frequency-Max

1286.0 MHz

Combinatorial Delay of a CLB-Max

0.61 ns

Dedicated DSP

840

Device Logic Cells

326,080

Device Logic Units

203,800

Device Number of DLLs/PLLs

10

Display Mode

HMDI Output

REACH Compliant

Yes

EU RoHS Compliant

Yes

Interface Standards

FMC LPC; I2C; HPC; XADC; SMA; SFP+

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e1

Lead Finish(Plating)

SnAgCu

Mounting Type

Surface Mount

Maximum Operating Temperature

85 °C

Minimum Operating Temperature

0 °C

Maximum Reflow Temperature

245 °C

Maximum Voltage Supply

1.03 V

Minimum Voltage Supply

0.97 V

Memory Card Interface

SD Card

Memory Size

1GB

Memory Type

DDR3

Number of I/Os

500

Number of Logic Blocks (LABs)

25475

Number of Logic Elements/Cells

326080

Total RAM Bits

16404480

Total Number of Block RAM

445

Number of Multipliers

840 (25x18)

Number of Registers

407600

Number of Inputs

500

Number of Outputs

500

Number of Terminals

900

Organization

25475 CLBS

Package / Case

900-BBGA, FCBGA

Mfr Package Description

FBGA-900

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Power Supplies

1,1.8,3.3

Pin Count

900

PCI Blocks

1

Process Technology

28 nm

Product Dimensions

31 x 31 x 2.85 mm

Length

31.0 mm

Width

31.0 mm

Height

2.85 mm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Program Memory Type

SRAM

Re-programmability Support

1

Reflow Solder Time (Sec)

30

Screening Level

Commercial

Seated Plane Height

3.15 mm

Speed Grade

-2

Sub Category

Field Programmable Gate Arrays

Supplier Device Package

900-FCBGA (31x31)

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Transceiver Blocks

16

Transceiver Speed

12.5 Gbps

Typical Operating Supply Voltage

1 V

USB

USB-Serial Bridge


Features

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Overview

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

◆ Avionics for Kintex-7 FPGA

◆ LED Backlit Flat Panel Displays and 3DTV

◆ LTE Baseband Solution


ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542390001"8542.39.00.01

SCHEDULE B

8542390000"8542.39.00.00


Documents & Media

Datsheets

Kintex-7 FPGAs Datasheet

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc.is an American technology company, primarily a supplier of programmable logic devices. It is known as the semiconductor company that invented the field-programmable gate array (FPGA) and created the first fabless manufacturing model.

Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

 

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

1043

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

DigiKey

34

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Avnet

309

Xilinx

FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FC-BGA


Alternative Models

There is no relevant information available for this part yet.


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