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XC3S50A-4VQG100C

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Xilinx
Description: IC FPGA 68 I/O 100VQFP
  datasheetXC3S50A-4VQG100C  Datasheet
Package: 100-TQFP
Quantity: 8618 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

CAD Models

 XC3S50A-4VQG100C   Symbol 

 XC3S50A-4VQG100C   Symbol

 XC3S50A-4VQG100C   Footprint

XC3S50A-4VQG100C   Footprint


Lifecycle Status Indicator

 XC3S50A-4VQG100C  Lifecycle Status Indicator

 XC3S50A-4VQG100C  Lifecycle Status Indicator


Product Attributes

Manufacturer

Xilinx Inc.

Product Category

Embedded - FPGAs (Field Programmable Gate Array)

Series

Spartan®-3A

Status

Active

Contact Plating

Tin, Matte

Clock Management

DLL

Combinatorial Delay of a CLB-Max

0.71 ns

REACH Compliant

Yes

EU RoHS Compliant

Yes

FPGA Family

Spartan-3A

Fabrication Technology

90 nm

Frequency

250MHz

JESD-30 Code

S-PQFP-G100

JESD-609 Code

e3

Lead Finish(Plating)

Matte Sn annealed

Terminal Base Material

Cu

Logic Case Style

VQFP

Mounting Type

Surface Mount

Maximum Processing Temperature

260

Maximum Operating Temperature

85 °C

Minimum Operating Temperature

0 °C

Maximum Operating Supply Voltage

1.26 V

Typical Operating Supply Voltage

1.2 V

Minimum Operating Supply Voltage

1.14 V

Maximum Internal Frequency

667 MHz

Number of Gates

50000

Number of I/Os

68

Number of Inputs

68

Number of Outputs

62

Number of LABs/CLBs

176

Number of Logic Elements/Cells

1584

Number of Macrocells

1584

Number of Multipliers

3 (18x18)

Number of Pins

100

Operating Supply Voltage

1.2V

Organization

176 CLBS, 50000 GATES

Package / Case

100-TQFP

Mfr Package Description

16 X 16 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VQFP-100

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Equivalence Code

TQFP100,.63SQ

Package Shape

SQUARE

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature

260 °C

Pin Count

100

Pin Pitch

0.5 mm

PCB

100

Product Dimensions

14 x 14 x 1 mm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Program Memory Type

SRAM

RAM Size

55296b

Re-programmability Support

1

Reflow Solder Time (Sec)

30

Number of Reflow Cycle

3

Seated Height-Max

1.2 mm

Screening Level

Commercial

Speed Grade

4

Sub Category

Field Programmable Gate Arrays

Supplier Device Package

100-VQFP (14x14)

Transceiver Speed

0.622Gbps

Termination

SMD/SMT

Terminal Finish

Matte Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Total RAM Bits

54Kbit

Total Number of Block RAM

3


Dimensions

Height

1 mm

Length

14 mm

Widt

14 mm


Overview

The XC3S50A-4VQG100C is a Spartan-3A FPCA device in 100 pin VQFP package. This device solves design challenges in most high volume, cost sensitive and I/O intensive electronic applications. It provides improve system performance and reduce the cost of configuration. Spartan-3A family enhancements combined with proven 90nm process technology deliver more functionality and bandwidth. The Spartan-3A device is a superior alternative to mask programmed ASICs. It avoids high initial cost, lengthy development cycles and the inherent inflexibility of conventional ASICs and permit field design upgrades.


Features

 Very low cost, high-performance logic solution for high-volume, cost-conscious applications

● Dual-range VCCAUX supply simplifies 3.3V-only design

● Suspend, Hibernate modes reduce system power

● Multi-voltage, multi-standard SelectIO™ interface pins

● Up to 502 I/O pins or 227 differential signal pairs

● LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O

● 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

● Selectable output drive, up to 24 mA per pin

● QUIETIO standard reduces I/O switching noise

● Full 3.3V ± 10% compatibility and hot swap compliance

● 640+ Mb/s data transfer rate per differential I/O

● LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors

● Enhanced Double Data Rate (DDR) support

● DDR/DDR2 SDRAM support up to 400 Mb/s

● Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support

● Abundant, flexible logic resources

● Densities up to 25,344 logic cells, including optional shift register or distributed RAM support

● Efficient wide multiplexers, wide logic

● Fast look-ahead carry logic

● Enhanced 18 x 18 multipliers with optional pipeline

● IEEE 1149.1/1532 JTAG programming/debug port

● Hierarchical SelectRAM™ memory architecture

● Up to 576 Kbits of fast block RAM with byte write enables for processor applications

● Up to 176 Kbits of efficient distributed RAM

● Up to eight Digital Clock Managers (DCMs)

● Clock skew elimination (delay locked loop)

● Frequency synthesis, multiplication, division

● High-resolution phase shifting

● Wide frequency range (5 MHz to over 320 MHz)

● Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

● Configuration interface to industry-standard PROMs

● Low-cost, space-saving SPI serial Flash PROM

● x8 or x8/x16 BPI parallel NOR Flash PROM

● Low-cost Xilinx® Platform Flash with JTAG

● Unique Device DNA identifier for design authentication

● Load multiple bitstreams under FPGA control

● Post-configuration CRC checking

● Complete Xilinx ISE® and WebPACK™ development system software support plus Spartan-3A Starter Kit

● MicroBlaze™ and PicoBlaze™ embedded processors

● Low-cost QFP and BGA packaging, Pb-free options

● Common footprints support easy density migration

● Compatible with select Spartan-3AN nonvolatile FPGAs

● Compatible with higher density Spartan-3A DSP FPGAs


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

Embedded Design & Development

Consumer Electronics

Communications & Networking

Portable Devices


Compliance

REACH SVHC

Unknown

Radiation Hardening

No

RoHS

Compliant


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542390001

SCHEDULE B

8542390000


Documents & Media

Datasheets

Spartan-3A FPGA Datasheet

Spartan-3A Brochure

Extended Spartan-3A Family Overview


Product Manufacturer

Xilinx, the first semiconductor company to utilize a fabless manufacturing model, has aggressively expanded its product portfolio since its founding in 1984. Servicing the end markets of communications, industrial, consumer, automotive and data processing, Xilinx is one of the world leading suppliers of programmable logic devices. With their innovative manufacturing methods and their constantly evolving product line, Xilinx is in a unique position to guarantee their customers timely, cost-efficient and cutting-edge solutions.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

 

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

8618

Xilinx Inc.

IC FPGA 68 I/O 100VQFP

DigiKey

3231

Xilinx Inc.

IC FPGA 68 I/O 100VQFP

Avnet

0

Xilinx

FPGA Spartan-3A Family 50K Gates 1584 Cells 667MHz 90nm Technology 1.2V 100-Pin VTQFP


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 XC3S50A-4VQG100C   Popularity by Region

 XC3S50A-4VQG100C   Popularity by Region


Market Price Analysis

  XC3S50A-4VQG100C   Market Price Analysis

 XC3S50A-4VQG100C   Market Price Analysis


Pictures

XC3S50A-4VQG100CXC3S50A-4VQG100C XC3S50A-4VQG100C

 XC3S50A-4VQG100C  Images 

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