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Manufacturer Part#:

A3P030-1QNG48I

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Microsemi
Description: IC FPGA 34 I/O 48QFN
  datasheetA3P030-1QNG48I  Datasheet
Package: 48-VFQFN Exposed Pad
Quantity: 146 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
Click buy button to purchase: Buy
PRODUCT DETAILS

CAD Models

A3P030-1QNG48I   Symbol.png

A3P030-1QNG48I   Symbol

A3P030-1QNG48I   Footprint.png

A3P030-1QNG48I   Footprint


Lifecycle Status Indicator

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A3P030-1QNG48I  Lifecycle Status Indicator


Product Attributes

Manufacturer

Microsemi Corporation

Product Category

Embedded - FPGAs (Field Programmable Gate Array)

Series

ProASIC3

Brand

Microsemi

EU RoHS

Compliant

ECCN (US)

EAR99

JESD-30 Code

S-XQCC-N48

JESD-609 Code

e3

Mounting Style

SMD/SMT

Mounting Type

Surface Mount

Maximum Operating Temperature

100 °C

Minimum Operating Temperature

-40 °C

Maximum Voltage Supply

1.575 V

Normal Supply Voltage

1.5 V

Minimum Voltage Supply

1.425 V

Maximum Operating Frequency

272 MHz

Maximum I/O Performance

700Mbps

Maximum Reflow Temperature

260 °C

Number of Gates

30000

Number of I/O

34

Number of I/O Banks

2

Number of Registers

768

Number of Inter Dielectric Layers

7

Number of Pins

48

Number of CLBs

768

Number of Inputs

34

Number of Logic Cells

768

Number of Outputs

34

Number of Reflow Cycle

3

Organization

768 CLBS, 30000 GATES

Operating Supply Current

2 mA

Package / Case

48-VFQFN Exposed Pad

Mfr Package Description

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-48

Package Body Material

UNSPECIFIED

Package Code

HQCCN

Package Equivalence Code

LCC48,.24SQ,16

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5,1.5/3.3

PCB changed

48

Program Memory Type

Flash

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Reflow Solder Time (Sec)

20 to 40

Seated Plane Height

0.9 mm

Speed Grade

1

Sub Category

Field Programmable Gate Arrays

Supplier Device Package

48-QFN (6x6)

Tradename

Actel

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

PURE TIN

Terminal Form

NO LEAD

Terminal Pitch

0.4 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max

30 s

Lead Finish(Plating)

Matte Sn annealed|Au

Under Plating Material

N/A|Pd over Ni


Dimensions

Height

0.88 mm

Length

6 mm

Width

6 mm


Features and Benefits

 High Capacity

• 15 K to 1 M System Gates

• Up to 144 Kbits of True Dual-Port SRAM

• Up to 300 User I/Os

 Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

 High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

 In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†

• FlashLock® to Secure FPGA Contents

 Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

 High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

 Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

 Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

 Embedded Memory†

  • 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

 ARM Processor Support in ProASIC3 FPGAs

• M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug


General Description

ProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3 devices the advantage of being a secure, low-power, single-chip solution that is live at power-up (LAPU). ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.

ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Actel ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.


Diagram

A3P030-1QNG48I   Diagram.png

A3P030-1QNG48I   Diagram


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


Compliance

Radiation Hardening

No

RoHS

Compliant


Product Manufacturer

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.


Product Range

Audio & Voice

Circuit Protection

Drivers, Interfaces, and PCIe Switches

Ethernet and PoE Solutions

FPGA & SoC

Optical Networking

Power Discretes & Modules

Power Management

RF, Microwave & Millimeter Wave


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

146

Microsemi Corporation

IC FPGA 34 I/O 48QFN

DigiKey

0

Microsemi Corporation

IC FPGA 34 I/O 48QFN

Mouser 

0

Microsemi

FPGA - Field Programmable Gate Array ProASIC3


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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A3P030-1QNG48I   Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.

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