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Product Attributes

Dimensions

Features

◆ Low Power

   • nanoPower Consumption—Industry’s Lowest Power

   • 1.2 V to 1.5 V Core Voltage Support for Low Power

   • Supports Single-Voltage System Operation

   • Low Power Active FPGA Operation

   • Flash*Freeze Technology Enables Ultra-Low Power Consumption while Maintaining FPGA Content

   • Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode

◆ Small Footprint Packages

   • As Small as 3x3 mm in Size

◆ Wide Range of Features

   • 10,000 to 250,000 System Gates

   • Up to 36 kbits of True Dual-Port SRAM

   • Up to 71 User I/Os

◆ Reprogrammable Flash Technology 

   • 130-nm, 7-Layer Metal, Flash-Based CMOS Process

   • Instant On Level 0 Support

   • Single-Chip Solution

   • Retains Programmed Design When Powered Off

   • 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance

◆ In-System Programming (ISP) and Security

   • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

   • FlashLock® Designed to Secure FPGA Contents

   • 1.2 V Programming

◆ High-Performance Routing Hierarchy

   • Segmented, Hierarchical Routing and Clock Structure

◆ Advanced I/Os

   • 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

   • Bank-Selectable I/O Voltages—up to 4 Banks per Chip

   • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V

   • Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

   • Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575 V

   • I/O Registers on Input, Output, and Enable Paths

   • Selectable Schmitt Trigger Inputs

   • Hot-Swappable and Cold-Sparing I/Os

   • Programmable Output Slew Rate and Drive Strength

   • Weak Pull-Up/-Down

   • IEEE 1149.1 (JTAG) Boundary Scan Test

   • Pin-Compatible Packages across the IGLOO® Family

◆ Clock Conditioning Circuit (CCC) and PLL†

   • Up to Six CCC Blocks, One with an Integrated PLL

   • Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback

   • Wide Input Frequency Range (1.5 MHz up to 250 MHz)

◆ Embedded Memory

   • 1 kbit of FlashROM User Nonvolatile Memory

   • SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

   • True Dual-Port SRAM (except × 18 organization)†

◆ Enhanced Commercial Temperature Range

   • Tj = -20°C to +85°C

General Description

The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. 

The Flash*Freeze technology used in IGLOO nano devices enables entering and exiting an ultra-low power mode that consumes nanoPower while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management with rapid recovery to operation mode.

The Low Power Active capability (static idle) allows for ultra-low power consumption while the IGLOO nano device is completely functional in the system. This allows the IGLOO nano device to control system power management based on external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power.

Nonvolatile flash technology gives IGLOO nano devices the advantage of being a secure, low power, single-chip solution that is Instant On. The IGLOO nano device is reprogrammable and offers time-tomarket benefits at an ASIC-level unit cost. 

These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. 

IGLOO nano devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The AGLN030 and smaller devices have no PLL or RAM support. IGLOO nano devices have up to 250 k system gates, supported with up to 36 kbits of true dual-port SRAM and up to 71 user I/Os.

 IGLOO nano devices increase the breadth of the IGLOO product line by adding new features and packages for greater customer value in high volume consumer, portable, and battery-backed markets. Features such as smaller footprint packages designed with two-layer PCBs in mind, power consumption measured in nanoPower, Schmitt trigger, and bus hold (hold previous I/O state in Flash*Freeze mode) functionality make these devices ideal for deployment in applications that require high levels of flexibility and low cost.

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Product Manufacturer

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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