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The Sino-US comparison in Information TechnologyPage Browsing:1941
IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...
Aug 4,2018 -
New Materials Selection Has Been an TrendPage Browsing:1484
Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...
Jul 26,2018 -
Common Guide for Selecting Electronic ComponentsPage Browsing:1566
Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization . c、Purchasing Rule The component...
Jul 25,2018 -
List of Integrated Circuit Packaging TypesPage Browsing:2646
Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...
Jul 24,2018 -
Why do Internet Giants Want to Self-develop Chips?Page Browsing:2122
IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...
Jul 21,2018
Ordering & Quality
Photo | Mfr. Part # | Company | Description | Package | Qty | MC33880PEW | Company:NXP / Freescale | Remark:IC SRL SWITCH OCT W/SPI 32SOIC | Package:32-SOIC (0.295", 7.50mm Width) |
MC33880PEW Datasheet |
In Stock:1064 Inquiry |
Inquiry | MC9S12XDG128MAA | Company:NXP | Remark:IC MCU 16BIT 128KB FLASH 80QFP | Package:80-QFP |
MC9S12XDG128MAA Datasheet |
In Stock:126 Inquiry |
Inquiry | CM2020-00TR | Company:ON Semiconductor | Remark:IC HDMI TX PORT P/I 38-TSSOP | Package:38-TFSOP (0.173", 4.40mm Width) Exposed Pad |
CM2020-00TR Datasheet |
In Stock:183990 Inquiry |
Inquiry | TMS320DM8127SCYED3 | Company:Texas Instruments | Remark:IC DGTL MEDIA PROCESSOR | Package:684-BFBGA, FCBGA |
TMS320DM8127SCYED3 Datasheet |
In Stock:433 Inquiry |
Inquiry | MPC8544CVTALFA | Company:NXP / Freescale | Remark:IC MPU MPC85XX 667MHZ 783FCBGA | Package:BGA |
MPC8544CVTALFA Datasheet |
In Stock:69 Inquiry |
Inquiry | MC68HC908LK24CFU | Company:NXP | Remark:IC MCU 8BIT 24KB FLASH 64QFP | Package:64-QFP |
MC68HC908LK24CFU Datasheet |
In Stock:3071 Inquiry |
Inquiry | W631GG6KB-15 | Company:Winbond Electronics | Remark:IC DRAM 1G PARALLEL 96WBGA | Package:FBGA |
W631GG6KB-15 Datasheet |
In Stock:3070 Inquiry |
Inquiry | MC9S12C64CFAE | Company:NXP / Freescale | Remark:IC MCU 16BIT 64KB FLASH 48LQFP | Package:48-LQFP |
MC9S12C64CFAE Datasheet |
In Stock:615 Inquiry |
Inquiry | MK20DX256VLH7 | Company:NXP / Freescale | Remark:IC MCU 32BIT 256KB FLASH 64LQFP | Package:64-LQFP |
MK20DX256VLH7 Datasheet |
In Stock:5060 Inquiry |
Inquiry | MRF9135LSR3 | Company:NXP / Freescale | Remark:IC MOSFET RF N-CHAN NI-780S | Package:NI-780S |
MRF9135LSR3 Datasheet |
In Stock:118 Inquiry |
Inquiry |