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Product Attributes

Overview

The MPC8544E PowerQUICC® III is designed to offer the unique combination of high performance, exceptional integration and lower overall power consumption required for networking, communications and industrial control applications.

The MPC8544E includes a high-performance e500 processor core built on Power Architecture® technology, enhanced peripherals and high-speed interconnect technology to balance processor performance with I/O system throughput enabling clock speeds scaling from 667 MHz up to 1.067 GHz. Third-generation PowerQUICC III processors are based on NXP®.s 90 nanometer (nm) silicon-on-insulator (SOI) copper interconnect process technology, which is designed to enable the processors to deliver higher performance with lower power dissipation.

The MPC8544E processor offers a wide range of high-speed connectivity options, including Gigabit Ethernet (GbE) interfaces with SGMII support and multiple PCI Express® connections. Support for these high-speed interfaces should enable scalable connectivity to network processors and/or ASICs in the data plane while the PowerQUICC III is designed to handle complex, computationally demanding control plane processing tasks. The MPC8544E is also designed to provide support for legacy PowerQUICC III interfaces such as PCI, I²C, dual universal asynchronous receiver/transmitters (DUART) and local bus connections. These processors are also designed to feature a next-generation double data rate (DDR2) memory controller, enhanced GbE support, v2 e500 double precision floating point and the field proven 90 nm PowerQUICC III integrated security engines.

Features

Embedded e500 core, initial offerings from 667 MHz up to 1.067 GHz

Dual dispatch superscalar, 7-stage pipeline design with out-of-order issue and execution

2,240 MIPS at 1.0 GHz (estimated Dhrystone 2.1)

36-bit physical addressing

Integrated L1/L2 cache

L1 cache—32 KB data and 32 KB instruction cache with line-locking support

L2 cache—256 KB (8-way set associative); 256/128/64/32 KB can be used as SRAM

L1 and L2 hardware coherency

L2 cache and I/O transactions can be stashed into L2 cache regions

Integrated DDR memory controller with full ECC support, offering:

200 MHz clock rate (400 MHz data rate), 64-bit, 2.5V/2.6V I/O, DDR SDRAM

267 MHz clock rate (up to 533 MHz data rate), 64-bit, 1.8V I/O, DDR2 SDRAM

Integrated security engine supporting DES, 3DES, MD-5, SHA-1/2, AES, RSA, RNG, Kasumi F8/F9 and ARC-4 encryption algorithms (MPC8544E)

Two on-chip enhanced triple speed Ethernet controllers (ETSECs) supporting 10 Mbps, 100 Mbps and 1 Gbps Ethernet/IEEE® 802.3 networks with MII, RMII, GMII, RGMII TBI and RTBI physical interfaces as well as SGMII interfaces through a dedicated SerDes.

TCP/UDP/IP checksum acceleration

Advanced QoS features

Enhanced hardware and software debug support

Double-precision embedded scalar and vector floating-point APUs

Memory management unit (MMU)

PCI Express high-speed interconnect interfaces, supporting combinations of dual x4 and single x1 PCI Express

On-chip network switch fabric

PCI interface support

32-bit PCI 2.2 bus controller (up to 66 MHz, 3.3V I/O)

Local bus

133 MHz, 32-bit, 3.3V I/O, local bus with memory controller

Integrated four-channel DMA controller

Dual I²C and DUART support

Programmable interrupt controller (PIC)

IEEE 1149.1 JTAG test access port

1.0V core voltage with 3.3V and 2.5V I/O

783-pin FC-PBGA package

Operating junction temperature range: TJ = 0º to +105ºC, Extended temperature range: TJ = -40º to +105ºC

Advantages and Disadvantages

Advantages

High level of integration and performance

Consistent programming model across the PowerQUICC III family

Flexible SoC platform for fast time to market

Simplified board design

Large L2 cache at 256 KB

High internal processing bandwidth

Integrated DDR and DDR2 memory controller

Two integrated Ethernet controllers (enhanced TSEC) with SGMII support

Large L2 cache at 256 KB

Flexible high-speed interconnection interfaces/multiple PCI Express connections

32-bit PCI support

Integrated security engine

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Compliance

ECCN / UNSPSC

Documents & Media

Product Manufacturer

NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.

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