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MCIMX353DJQ5C

Product Category: Embedded - Microprocessors
Manufacturer: NXP / Freescale
Description: IC MPU I.MX35 532MHZ 400MAPBGA
  datasheetMCIMX353DJQ5C  Datasheet
Package: 400-LFBGA
Quantity: 24833 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: one to seven days
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PRODUCT DETAILS

CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - Microprocessors

EU RoHS Compliant

Yes

Series

i.MX35

Status

Active

Package Description

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Application

Multimedia Applications

Base Part Number

MCIMX353

Core Processor

ARM1136JF-S

Contact Plating

Copper, Tin, Silver

Core Architecture

ARM

Co-Processors/DSP

Multimedia; GPU, IPU, VFP

Data Bus Width

32b

Display & Interface Controllers

Keypad, KPP, LCD

Data ROM Size

32 kB

Data RAM Size

128 kB

Ethernet

10/100Mbps (1)

Frequency

532MHz

Graphics Acceleration

Yes

Interface

I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI

I/O Voltage

1.75 V to 3.6 V

JESD-30 Code

S-PBGA-B400

JESD-609 Code

e1

L2 Cache Instruction / Data Memory

128 kB

L1 Cache Instruction Memory

16 kB

L1 Cache Data Memory

16 kB

Memory Type

L1/L2 Cache, ROM, SRAM

Moisture Sensitive

Yes

Max Supply Voltage

1.47V

Memory Size

32KB

Memory Type

SRAM, ROM, L2 Cache

Min Supply Voltage

1.33V

Max Processing Temp

260

Mount

Surface Mount

Maximum Clock Frequency

532 MHz

Number of Cores/Bus Width

1 Core, 32-Bit

Number of Timers/Counters

1

Number of Terminals

400

SATA

-

USB

USB 2.0 + PHY (2)

Number of Pins

400

Operating Temperature

-20°C ~ 70°C (TA)

Operating Supply Voltage

1.33 V to 1.47 V

Package Quantity

450

Product Dimensions

17 x 17 x 1.18 mm

Packaging

Tray

Product Type

Processors - Application Specialized

Processor Series

i.MX353

Package / Case

400-LFBGA

Supplier Device Package

400-MAPBGA (17x17)

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Qualification Status

Not Qualified

RAM Controllers

LPDDR, DDR2

RAM Size

128 kB

RAM (words)

128,000

Rohs Code

Yes

Risk Rank

1.77

Speed

532 MHz

Surface Mount

Yes

Seated Height-Max

1.6 mm

Security Features

Secure Fusebox, Secure JTAG, Tamper Detection

Subcategory

Processors - Application Specialized

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Length

17.0 mm

Width

17.0 mm

Tradename

i.MX

Watchdog Timer

1

Voltage - I/O

1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Additional Interfaces

1-Wire, ASRC, ATA, CAN, I²C, I²S, MMC/SDIO, SAI, SPI, SSI, UART

Additional Feature

IT ALSO OPERATES AT 1.22 TO 1.47 V

uPs/uCs/Peripheral ICs Type

MULTIFUNCTION PERIPHERAL


Overview

The ARM11-based i.MX353 multimedia applications processors is targeted for consumer and industrial applications. To reduce the BOM costs it is packed with connectivity options including UARTs, SPIs, Ethernet, two Controller Area, Network (CAN) modules, two USB ports with integrated PHYs, ESAI and three MMC/SD/SDIO ports. The i.MX353 has the ability to connect to external wireless modules via a USB or SDIO port and supports external storage via CE-ATA or PATA. Support for cost-effective memory options like DDR2 and multi-level cell NAND reduce system costs and provide the design engineer great flexibility. The i.MX353 is supported by companion Freescale power management ICs (PMIC), MC13892 and MMPF0100.


Features

  • ARM1136JF-S™

  • 532 MHz maximum speed

  • 128 KB Integrated SRAM

  • 16 KB I/D L1 Cache, 128 KB L2 cache

  • Image Processing Unit (IPU)

  • LCD Controller

  • 10/100 Ethernet

  • MAC 2 x FlexCan modules

  • HS OTG + PHY, HS Host + PHY

  • 3 x UART, 2 x CSPI, 3 I2C, 2 SSI/I2S

  • P-ATA/CE-ATA

  • Optimized for up to 24-bit-per-pixel WVGA

  • CMOS/CCD sensor interface

  • Vector Floating Point Unit

  • External memory interface: mSDRAM/SDRAM, mDDR/DDR2, NOR, SLC/MLC NAND

  • 3.3V general purpose I/O


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

 There is no relevant information available for this part yet.


Compliance

RoHS

Compliant

Radiation Hardening

No

REACH SVHC

No SVHC


ECCN / UNSPSC

Description

Value

ECCN

5A992

HTSN

8542310001

SCHEDULE B

8542310000


Documents & Media

Datasheets

IMX35 For Industrial & Consumer Products

Environmental Information

NXP RoHS3 Cert


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.


Product Range

Integrated Circuits (ICs)

Microcontrollers - MCU

8 Bit Microcontrollers - MCU

Semiconductors

Embedded Processors & Controllers

Microcontrollers - MCU


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

24833 PCS

NXP Semiconductors

IC MPU I.MX35 532MHZ 400MAPBGA

DigiKey

719 PCS

NXP Semiconductors

IC MPU I.MX35 532MHZ 400MAPBGA

Mouser

130 PCS

NXP Semiconductors

Processors - Application Specialized RINGO MX35 TO2.1

Arrow

69 PCS

NXP Semiconductors

SOC i.MX35 ARM1136JF-S 0.09um 400-Pin MAP-BGA Tray


Alternative Models

There is no relevant information available for this part yet.


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Market Price Analysis

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