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The Sino-US comparison in Information TechnologyPage Browsing:1953
IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...
Aug 4,2018 -
New Materials Selection Has Been an TrendPage Browsing:1494
Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...
Jul 26,2018 -
Common Guide for Selecting Electronic ComponentsPage Browsing:1580
Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization . c、Purchasing Rule The component...
Jul 25,2018 -
List of Integrated Circuit Packaging TypesPage Browsing:2683
Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...
Jul 24,2018 -
Why do Internet Giants Want to Self-develop Chips?Page Browsing:2135
IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...
Jul 21,2018
Ordering & Quality
Photo | Mfr. Part # | Company | Description | Package | Qty | MC68CK16Z1CAG16 | Company:NXP | Remark:IC MCU 16BIT 144LQFP | Package:144-LQFP |
MC68CK16Z1CAG16 Datasheet |
In Stock:18655 Inquiry |
Inquiry | TMS320DM6433ZWTQ5 | Company:Texas Instruments | Remark:IC DGTL MEDIA PROCESSOR 361-BGA | Package:361-LFBGA |
TMS320DM6433ZWTQ5 Datasheet |
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Inquiry | 70V7599S166BCI8 | Company:IDT | Remark:SRAM 128K x 36 Synchronous Bank-Switchable Dual-Port SRAM | Package: |
70V7599S166BCI8 Datasheet |
In Stock:2 Inquiry |
Inquiry | MC33742PEG | Company:NXP / Freescale | Remark:IC SYSTEM BASE W/CAN 28SOIC | Package:28-SOIC (0.295", 7.50mm Width) |
MC33742PEG Datasheet |
In Stock:28162 Inquiry |
Inquiry | FCSL64R010FER | Company:Ohmite | Remark:RES SMD 0.01 OHM 2W 2512 WIDE | Package:Wide 2512 (6432 Metric), 1225 |
FCSL64R010FER Datasheet |
In Stock:2954 Inquiry |
Inquiry | ICE65L04F-TCS63I | Company:Lattice | Remark:IC FPGA 48 I/O 63WLCSP | Package:BGA63 |
ICE65L04F-TCS63I Datasheet |
In Stock:5759 Inquiry |
Inquiry | TMMBAT46FILM | Company:STMicroelectronics | Remark:DIODE SCHOTTKY 100V 150MA MINMLF | Package:DO-213AA (Glass) |
TMMBAT46FILM Datasheet |
In Stock:48488 Inquiry |
Inquiry | MC9RS08KB2CSC | Company:NXP | Remark:IC MCU 8BIT 2KB FLASH 8SOIC | Package:8-SOIC (0.154", 3.90mm Width) |
MC9RS08KB2CSC Datasheet |
In Stock:10913 Inquiry |
Inquiry | MC9S12GC64MFUE | Company:NXP | Remark:IC MCU 16BIT 64KB FLASH 80QFP | Package:80-QFP |
MC9S12GC64MFUE Datasheet |
In Stock:4926 Inquiry |
Inquiry | MCIMX31LCVKN5D | Company:NXP / Freescale | Remark:IC MPU I.MX31 532MHZ 457MAPBGA | Package:457-LFBGA |
MCIMX31LCVKN5D Datasheet |
In Stock:147 Inquiry |
Inquiry |