• The Sino-US comparison in Information TechnologyPage Browsing:1938

    IntroductionInformation and Communication Technology (ICT) is the core technology and important engine of the third industrial revolution. As a versatile technology, information technology is considered to be an important symbol of comprehensive national strength for its obvious extensive effects on other industries and overall economic growth, and its vital role to national security and military ...

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  • New Materials Selection Has Been an TrendPage Browsing:1483

    Materials selection has become an increasingly serious challenge for the entire semiconductor supply chain.At present,new material supply is a kind of market demand, and the new material content in the chip is increasing along with higher-required density and functionality. But the trend to solve the material problem begins sweeping the market even though not all products are in their newest proce...

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  • Common Guide for Selecting Electronic ComponentsPage Browsing:1564

    Ⅰ.Basic Rules for Selecting Electronic ComponentsA simple guide to electronic components.a、Universal Rule  We need to choose widely-used components to reduce the development risks.b、High Cost Effective Rule  It is necessary to select electronic components with lower price to reduce cost when they have the similar performance and utilization .    c、Purchasing Rule  The component...

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  • List of Integrated Circuit Packaging TypesPage Browsing:2645

    Packaging means that the circuit pins on the silicon chip are wired to the external connectors for connection with other devices, or it refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the shell of package by wi...

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  • Why do Internet Giants Want to Self-develop Chips?Page Browsing:2121

    IntroductionAt present, global network service giants such as Google, Microsoft, Facebook, and Amazon begin to enter the independent research and development of chipset solutions, and invest heavily. In 2017, Amazon spent $22.6 billion on research and development, up 41% from 2016, and quite a few of it was used to design customized artificial intelligence chips. Alphabet, Intel, Microsoft and App...

    Jul 21,2018

Ordering & Quality

Photo Mfr. Part # Company Description Package PDF Qty
PMEG3030EP-115 MC68332GCEH20 Company:NXP / Freescale Remark:IC MCU 32BIT 132PQFP Package:132-BQFP Bumpered
MC68332GCEH20  Datasheet
In Stock:2569
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PMEG3030EP-115 XC6SLX100-N3FGG676I Company:Xilinx Inc. Remark:IC FPGA 480 I/O 676FBGA Package:FBGA
XC6SLX100-N3FGG676I  Datasheet
In Stock:82
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PMEG3030EP-115 MC68882CFN25A Company:NXP Remark:- Package:PLCC68
MC68882CFN25A  Datasheet
In Stock:115
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PMEG3030EP-115 MC908LJ12CFUE Company:NXP Remark:IC MCU 8BIT 12KB FLASH 64QFP Package:64-QFP
MC908LJ12CFUE  Datasheet
In Stock:457
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PMEG3030EP-115 CAP017DG Company:Power Integrations Remark:IC CAP DISCHRG 1000V 2500NF 8SO Package:8-SOIC (0.154", 3.90mm Width)
CAP017DG  Datasheet
In Stock:7450
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PMEG3030EP-115 RB400DT146 Company:Rohm Semiconductor Remark:DIODE SCHOTTKY 40V 500MA SMD3 Package:TO-236-3, SC-59, SOT-23-3
RB400DT146  Datasheet
In Stock:9266
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PMEG3030EP-115 MPC8360ECZUAJDGA Company:Freescale Semiconductor - NXP Remark:IC MPU MPC83XX 533MHZ 740TBGA Package:740-LBGA
MPC8360ECZUAJDGA  Datasheet
In Stock:73
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PMEG3030EP-115 DS1816R-5+T&R Company:Maxim Integrated Remark:IC 3.06V OD 5% SOT23-3 Package:TO-236-3, SC-59, SOT-23-3
DS1816R-5+T&R  Datasheet
In Stock:7060
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PMEG3030EP-115 D2TO035CR0500FTE3 Company:Vishay Sfernice Remark:RES SMD 0.05 OHM 1% 35W TO263 Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
D2TO035CR0500FTE3  Datasheet
In Stock:70
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PMEG3030EP-115 DSS16-01AS Company:IXYS Remark:DIODE SCHOTTKY 100V 16A TO263AB Package:TO-263-3, D²Pak (2 Leads + Tab), TO-
DSS16-01AS  Datasheet
In Stock:580
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